因通常出现在一些球栅阵列 (BGA) 设备回流期间的翘曲导致的焊料球或焊料桥之间的意外连接被称为桥连。如果调节回流波形或在印刷电路板 (PCB) 上重新放置设备无法解决这一问题，Alpha 提供了另一种解决方案。为了防止翘曲导致的焊料桥连，请使用ALPHA®TrueHeight® 垫块。它们可以在 BGA 角落下保持最小隔离高度，从而停止导致焊料桥连的过度翘曲。

有助于防止桥连的 Alpha 产品：

锡膏

Alpha 焊料合金

使用下图确定哪种 Alpha 合金适合您。只需将进行组装的类型与适当的合金对应起来即可。

Assembly Type

I

II

III

IV

Simple, single sided, FR2 / CEM-1 laminates

Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes

Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air

>2.4mm thick, >12 inner copper layers, large high heat capacity components

SACX Plus 0807

1%+ flux solids, L0, pin testable

Flux Type

SACX Plus 0307

4%+ flux solids, L or M0, pin testable

SnCX Plus 07

4%+ flux solids, L or M0, moderately pin testable

7%+ flux solids, L,M or H1, not pin testable

0ºC to 100ºC - standard profile cycles

0ºC to 100ºC - standard and shock profile cycles

- 25ºC to 125ºC - standard and shock profile cycles

- 45ºC to 125ºC - standard and shock profile cycles

Thermal Fatigue Resistance

药芯焊锡丝

• Telecore HF-850

• Telecore XL-825

液体助焊剂

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